Lapping & Polishing

The FLP 400, 600, and 700 series in single precision are ideal for various applications, ranging from small individual parts to medium-sized batches, ensuring top-notch quality and precision. These machines are known for their reliability, providing excellent efficiency and long-term investment value, making them suitable even for small batch production.

FLP Microfinishing GmbH specializes in developing cutting-edge machine concepts for specialized polishing equipment, especially for flat optics applications. Our systems are created based on our unique designs and innovations, providing unparalleled technological assistance throughout the entire operation. The global installation of our machines demonstrates their substantial economic advantages and reliability.

The FLP 830, 940, 1100, and 1300 series stands out for its exceptional precision, offering superior stability and smooth operation. These machines incorporate cutting-edge control, drive, and measurement technology, following a cohesive design concept throughout the entire range.

The all-encompassing idea behind the FLP 900, 1000, 1200, and 1500 series in single precision is to provide exceptional performance, stability, and seamless operation while ensuring high productivity and user-friendly features. Quality machining is achieved through a combination of ergonomics, optimized movements, high rigidity, and fully FEM-optimized machine designs.

FLP Microfinishing has developed CMP wafer polishing machines for the semiconductor industry, including the latest FLP Wafer 1700 nano designed for double-sided wafer polishing. With chemically resistant granite wheels and servo drives for precision control, this machine ensures high tool finish accuracy. It can process various substrates besides silicon prime wafers, such as gallium arsenide, silicon carbide, and sapphire.